Substrate measurement subsystem

ABSTRACT

A method for a substrate measurement subsystem is provided. An indication is received that a substrate being processed at a manufacturing system has been loaded into a substrate measurement subsystem. First positional data of the substrate within the substrate measurement subsystem is determined. One or more portions of the substrate to be measured by one or more sensing components of the substrate measurement subsystem are determined based on the first positional data of the substrate and a process recipe for the substrate. Measurements of each of the determined portions of the substrate are obtained by one or more sensing components of the substrate measurement subsystem. The obtained measurements of each of the determined portions of the substrate are transmitted to a system controller.

RELATED APPLICATION

This application claims benefit of U.S. Provisional Patent Application63/055,242, filed Jul. 22, 2020, the entire content of which isincorporated by reference herein.

TECHNICAL FIELD

Embodiments of the present disclosure relate, in general, tomanufacturing systems and more particularly to a substrate measurementsubsystem.

BACKGROUND

Processing of a substrate at a manufacturing system generally includesmultiple processing operations that are performed for the substrate inaccordance with a pre-determined process recipe. In some instances, oneor more conditions at the manufacturing system can change unexpectedlyduring the processing of the substrate. If the substrate is processedaccording to the pre-determined process recipe as the change inmanufacturing conditions occur, errors can result during the process anda finished substrate can be defective. In some instances, an operationof the process recipe can be modified in view of the changed conditionin order to prevent the error from occurring during the processing ofthe substrate. However, it can be difficult for an operator of themanufacturing system to identify which operation of the process recipeshould be modified.

SUMMARY

Some of the embodiments described cover a method including receiving anindication that a substrate being processed at a manufacturing systemhas been loaded into a substrate measurement subsystem. The methodfurther includes determining first positional data of the substratewithin the substrate measurement subsystem. The method further includesdetermining, based on the first positional data of the substrate and aprocess recipe for the substrate, one or more portions of the substrateto be measured by one or more sensing components of the substratemeasurement subsystem. The method further includes obtainingmeasurements of each of the determined portions of the substrate by oneor more sensing components of the substrate measurement subsystem. Themethod further includes transmitting the obtained measurements of eachof the determined portions of the substrate to a system controller.

In some embodiments, a manufacturing system includes one or more sensingcomponents configured to obtain measurements for one or more portions ofa substrate within the substrate measurement subsystem, and a controllercoupled to the one or more sensing components. The controller is toreceive an indication that a substrate being processed at amanufacturing system has been loaded into the substrate measurementsubsystem. The controller is further to determine first positional dataof the substrate within the substrate measurement subsystem. Thecontroller is further to determine, based on the first positional dataof the substrate and a process recipe for the substrate, one or moreportions of the substrate to be measured by one or more sensingcomponents of the substrate measurement subsystem. The controller isfurther to transmit the obtained measurements of each of the determinedportions of the substrate to a system controller.

In some embodiments, a non-transitory computer readable storage mediumincludes instructions that, when executed by a processing device, causethe processing device to receive an indication that a substrate beingprocessed at a manufacturing system has been loaded into a substratemeasurement subsystem. The instructions further cause the processingdevice to determine first positional data of the substrate within thesubstrate measurement subsystem. The instructions further cause theprocessing device to determine, based on the first positional data ofthe substrate and a process recipe for the substrate, one or moreportions of the substrate to be measured by one or more sensingcomponents of the substrate measurement subsystem. The instructionsfurther cause the processing device to obtain measurements of each ofthe determined portions of the substrate by one or more sensingcomponents of the substrate measurement subsystem. The instructionsfurther cause the processing device to transmit the obtainedmeasurements of each of the determined portions of the substrate to asystem controller.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure is illustrated by way of example, and not by wayof limitation, in the figures of the accompanying drawings in which likereferences indicate similar elements. It should be noted that differentreferences to “an” or “one” embodiment in this disclosure are notnecessarily to the same embodiment, and such references mean at leastone.

FIG. 1 is a top schematic view of an example manufacturing system,according to aspects of the present disclosure.

FIG. 2 is a cross-sectional schematic side view of a substratemeasurement subsystem, according to aspects of the present disclosure.

FIG. 3 is a cross-sectional schematic side view of a processing chamber,according to aspects of the present disclosure.

FIG. 4 is a block diagram illustrating a system controller, according toaspects of the present disclosure.

FIG. 5 illustrates an example graphical user interface for providingnotifications to an operator of a manufacturing system, according toaspects of the present disclosure.

FIG. 6 illustrates spectral data collected for a substrate, according toaspects of the present disclosure.

FIG. 7 is a flow chart of a method for determining whether to modify aprocess recipe for a wafer, according to aspects of the presentdisclosure.

FIG. 8 is a flow chart of another method for determining whether tomodify a process recipe for a wafer, according to aspects of the presentdisclosure.

FIG. 9 is a flow chart of a method for obtaining spectral data for asubstrate at a substrate measurement subsystem, according to aspects ofthe present disclosure.

FIG. 10 is a flow chart of a method for determining positional data fora substrate within a substrate measurement subsystem, according toaspects of the present disclosure.

FIG. 11 illustrates a diagrammatic representation of a machine in theexample form of a computing device within which a set of instructions,for causing the machine to perform any one or more of the methodologiesdiscussed herein, can be executed

DETAILED DESCRIPTION OF EMBODIMENTS

Implementations described herein provide an integrated substratemeasurement system to improve manufacturing process performance. Variouscomponents of the integrated substrate measurement system can beoperatively coupled to a system controller configured to control aprocess for a substrate at a manufacturing system. The system controllercan be configured to receive data from various portions of amanufacturing system and store data at a data store dedicated to storedata collected at the integrated substrate measurement system. Thesystem controller can receive data from one or more portions of themanufacturing system (e.g., a processing chamber, a load lock, etc.)before, during, or after processing of a substrate. The systemcontroller can also receive data from a substrate measurement subsystemincluded within the integrated substrate measurement system. Thesubstrate measurement subsystem may be integrated within one or moreportions of the manufacturing system (e.g., at a factory interface). Thesubstrate measurement subsystem may be configured to generate dataassociated with substrate before or after processing of the substrate atanother portion of the system.

The substrate measurement subsystem may be configured to generate one ormore types of data for the substrate, including spectral data,positional data, substrate property data, etc. The substrate measurementsubsystem can generate the data for the substrate in response to arequest to obtain one or more measurements for the substrate before orafter the substrate is processed at the manufacturing system. Thesubstrate measurement subsystem may include one or more components thatfacilitate the generation of data for the substrate. For example, thesubstrate measurement subsystem can include a spectra sensing componentfor sensing spectra or spectrum from a portion of the substrate andgenerating spectral data for the substrate. In some embodiments, thespectra sensing component can be an interchangeable component that canbe configurable based on a type of process performed at themanufacturing system or a target type of measurements to be obtained atthe substrate measurement subsystem. For example, one or more componentsof the spectra sensing component can be interchanged at the substratemeasurement subsystem to enable the collection of reflectometry spectraldata, ellipsometry spectral data, hyperspectral imaging data, chemicalimaging (e.g., x-ray photoelectron spectroscopy (XPS), energy-dispersivex-ray spectroscopy (EDX), (x-ray fluorescence (XRF), etc.) data, and soforth. The substrate measurement subsystem can also include positionalcomponents configured to modify a position and/or orientation of thesubstrate within the substrate measurement subsystem. The positionalcomponents can also generate positional data associated with thesubstrate. The substrate measurement subsystem can correlate positionaldata and spectral data generated for a portion of the substrate. Thesubstrate measurement subsystem may transmit the generated data (e.g.,spectral data, positional data, etc.), to the system controller of themanufacturing system.

Responsive to the system controller receiving data from the substratemeasurement subsystem and a portion of the manufacturing system, thesystem controller can determine whether to modify a process recipe forthe substrate. The system controller can generate a mapping between afirst set of data received from the substrate measurement component anda second set of data received from a portion of the manufacturingsystem. Responsive to generating the mapping between the first set ofdata and the second set of data, the system controller may determinewhether to modify the process recipe for the substrate based on themapping. In some embodiments, responsive to determining to modify theprocess recipe for the substrate, the system controller can transmit anotification to a user of the manufacturing system recommending that amodification should be made to the process recipe. The system controllermay modify the process recipe responsive to receiving a notificationfrom the user of the manufacturing system that the process recipe is tobe modified in accordance with the recommendation. In other or similarembodiments, the system controller may modify the process recipe withoutproviding an indication to the user of the manufacturing system.

Implementations of the present disclosure address the above noteddeficiencies conventional technology by providing a system fordetermining whether a modification is to be made for the process recipefor a substrate. By generating measurements for the substrate beforeduring, or after the substrate is processed at the manufacturing system,a system controller can determine if any changes have occurred withinthe manufacturing system that may affect the process for the substrate.Responsive to determining that a change has occurred within themanufacturing system, the system controller can determine a modificationto be made to the process recipe to prevent an error from occurringduring the substrate process as a result of the change to themanufacturing system. By modifying the process recipe for the substrate,the system controller decreases the likelihood that a processedsubstrate will be defective, therefore increasing overall throughput ofthe manufacturing system. Further, by integrating the substratemeasurement subsystem within the manufacturing system, an overallsampling rate of each substrate within the manufacturing systemincreases.

FIG. 1 is a top schematic view of an example manufacturing system 100,according to aspects of the present disclosure. Manufacturing system 100may perform one or more processes on a substrate 102. Substrate 102 maybe any suitably rigid, fixed-dimension, planar article, such as, e.g., asilicon-containing disc or wafer, a patterned wafer, a glass plate, orthe like, suitable for fabricating electronic devices or circuitcomponents thereon.

Manufacturing system 100 may include a process tool 104 and a factoryinterface 106 coupled to process tool 104. Process tool 104 may includea housing 108 having a transfer chamber 110 therein. Transfer chamber110 may include one or more processing chambers (also referred to asprocess chambers) 114, 116, 118 disposed therearound and coupledthereto. Processing chambers 114, 116, 118 may be coupled to transferchamber 110 through respective ports, such as slit valves or the like.

Processing chambers 114, 116, 118 may be adapted to carry out any numberof processes on substrates 102. A same or different substrate processmay take place in each processing chamber 114, 116, 118. A substrateprocess may include atomic layer deposition (ALD), physical vapordeposition (PVD), chemical vapor deposition (CVD), etching, annealing,curing, pre-cleaning, metal or metal oxide removal, or the like. In someembodiments, a substrate process may include a combination of two ormore of atomic layer deposition (ALD), physical vapor deposition (PVD),chemical vapor deposition (CVD), etching, annealing, curing,pre-cleaning, metal or metal oxide removal, or the like. In one example,a PVD process may be performed in one or both of process chambers 114,an etching process may be performed in one or both of process chambers116, and an annealing process may be performed in one or both of processchambers 118. Other processes may be carried out on substrates therein.Processing chambers 114, 116, 118 may each include one or more sensorsconfigured to capture data for substrate 102 and/or an environmentwithin processing chamber 114, 116, 118, before, after, or during asubstrate process. In some embodiments, the one or more sensors may beconfigured to capture data including a value of one or more of: spectraor spectrum (e.g., light spectra), temperature (e.g., heatertemperature), spacing (SP), pressure, high frequency radio frequency(HFRF), voltage of an electrostatic chuck (ESC), electrical current,flow, power, voltage, capacitance and so forth. Further details withrespect to processing chamber 114, 116, 118 are provided with respect toFIG. 3.

Transfer chamber 110 may also include a transfer chamber robot 112.Transfer chamber robot 112 may include one or multiple arms where eacharm includes one or more end effectors at the end of each arm. The endeffector may be configured to handle particular objects, such as wafers.Alternatively, or additionally, the end effector may be configured tohandle objects such as process kit rings. In some embodiments, transferchamber robot 112 may be a selective compliance assembly robot arm(SCARA) robot, such as a 2 link SCARA robot, a 3 link SCARA robot, a 4link SCARA robot, and so on.

A load lock 120 may also be coupled to housing 108 and transfer chamber110. Load lock 120 may be configured to interface with, and be coupledto, transfer chamber 110 on one side and factory interface 106. Loadlock 120 may have an environmentally-controlled atmosphere that may bechanged from a vacuum environment (wherein substrates may be transferredto and from transfer chamber 110) to an inert-gas environment at or nearatmospheric-pressure (wherein substrates may be transferred to and fromfactory interface 106) in some embodiments. In some embodiments, loadlock 120 may be a stacked load lock having a pair of upper interiorchambers and a pair of lower interior chambers that are located atdifferent vertical levels (e.g., one above another). In someembodiments, the pair of upper interior chambers may be configured toreceive processed substrates from transfer chamber 110 for removal fromprocess tool 104, while the pair of lower interior chambers may beconfigured to receive substrates from factory interface 106 forprocessing in process tool 104. In some embodiments, load lock 120 maybe configured to perform a substrate process (e.g., an etch or apre-clean) on one or more substrates 102 received therein.

Factory interface 106 may be any suitable enclosure, such as, e.g., anEquipment Front End Module (EFEM). Factory interface 106 may beconfigured to receive substrates 102 from substrate carriers 122 (e.g.,Front Opening Unified Pods (FOUPs)) docked at various load ports 124 offactory interface 106. A factory interface robot 126 (shown dotted) maybe configured to transfer substrates 102 between substrate carriers(also referred to as containers) 122 and load lock 120. In other and/orsimilar embodiments, factory interface 106 may be configured to receivereplacement parts from replacement parts storage containers 123. Factoryinterface robot 126 may include one or more robot arms and may be orinclude a SCARA robot. In some embodiments, factory interface robot 126may have more links and/or more degrees of freedom than transfer chamberrobot 112. Factory interface robot 126 may include an end effector on anend of each robot arm. The end effector may be configured to pick up andhandle specific objects, such as wafers. Alternatively, or additionally,the end effector may be configured to handle objects such as process kitrings.

Any conventional robot type may be used for factory interface robot 126.Transfers may be carried out in any order or direction. Factoryinterface 106 may be maintained in, e.g., a slightly positive-pressurenon-reactive gas environment (using, e.g., nitrogen as the non-reactivegas) in some embodiments.

In some embodiments, transfer chamber 110, process chambers 114, 116,and 118, and load lock 120 may be maintained at a vacuum level.Manufacturing system 100 may include one or more vacuum ports that arecoupled to one or more stations of manufacturing system 100. Forexample, first vacuum ports 130 a may couple factory interface 106 toload locks 120. Second vacuum ports 130 b may be coupled to load locks120 and disposed between load locks 120 and transfer chamber 110. Inother or similar embodiments, transfer chamber 110, process chambers114, 116, and 118, and/or load lock 120 may not be maintained at avacuum level.

Manufacturing system 100 may also be connected to a client device (notshown) that is configured to provide information regarding manufacturingsystem 100 to a user (e.g., an operator). A client device may include acomputing device such as a personal computer (PC), laptop, mobile phone,smart phone, tablet computer, netbook computer, network-connectedtelevision, etc. In some embodiments, the client device may provideinformation to a user of manufacturing system 100 via one or moregraphical user interfaces (GUIs). For example, the client device mayprovide information regarding one or more modifications to be made to aprocess recipe for a substrate 102 via a GUI.

Manufacturing system 100 may also include a system controller 128.System controller 128 may be and/or include a computing device such as apersonal computer, a server computer, a programmable logic controller(PLC), a microcontroller, and so on. System controller 132 may includeone or more processing devices, which may be general-purpose processingdevices such as a microprocessor, central processing unit, or the like.More particularly, the processing device may be a complex instructionset computing (CISC) microprocessor, reduced instruction set computing(RISC) microprocessor, very long instruction word (VLIW) microprocessor,or a processor implementing other instruction sets or processorsimplementing a combination of instruction sets. The processing devicemay also be one or more special-purpose processing devices such as anapplication specific integrated circuit (ASIC), a field programmablegate array (FPGA), a digital signal processor (DSP), network processor,or the like. System controller 128 may include a data storage device(e.g., one or more disk drives and/or solid state drives), a mainmemory, a static memory, a network interface, and/or other components.System controller 128 may execute instructions to perform any one ormore of the methodologies and/or embodiments described herein. In someembodiments, system controller 128 may execute instructions to performone or more operations at manufacturing system 100 in accordance with aprocess recipe. A process recipe include a series of operations to beperformed at the manufacturing system 100 in a specific order. Theinstructions may be stored on a computer readable storage medium, whichmay include the main memory, static memory, secondary storage and/orprocessing device (during execution of the instructions).

System controller 128 may receive data from sensors included on orwithin various portions of manufacturing system 100 (e.g., processingchambers 114, 116, 118, transfer chamber 110, load lock 120, etc.). Datareceived by the system controller 128 may include data associated withsubstrate 102 and/or an environment surrounding substrate 102 within aportion of manufacturing system 100. For purposes of the presentdescription, system controller 128 is described as receiving data fromsensors included within processing chambers 114, 116, 118. However,system controller 128 may receive data from any portion of manufacturingsystem 100 and may use data received from the portion in accordance withembodiments described herein. In an illustrative example, systemcontroller 128 may receive data from one or more sensors for processingchamber 114, 116, 118 before, after, or during a substrate process atthe processing chamber 114, 116, 118. In such example, the data receivedfrom processing chamber 114, 116, 118 may be associated with substrate102, including temperature data, a positional data (e.g., a positionand/or an orientation of the substrate 102 within processing chamber114, 116, 118), and so forth. Data received by system controller 128 mayalso be associated with an environment of processing chamber 114, 116,118, including data indicating a temperature or internal pressure ofprocessing chamber 114, 116, 118, an amount of radiation within theprocessing chamber 114, 116, 118, and so forth. Data received fromsensors of the various portions of manufacturing system 100 may bestored in a data store 150. Data store 150 may be included as acomponent within system controller 128 or may be a separate componentfrom system controller 128. Further details regarding data store 150 areprovided with respect to FIG. 4.

Manufacturing system 100 may include a substrate measurement subsystem140. Substrate measurement subsystem 140 may obtain measurements for oneor more portions of a substrate 102 before or after the substrate 102 isprocessed at manufacturing system 100. In some embodiments, substratemeasurement subsystem 140 may obtain measurements for one or moreportions of substrate 102 in response to receiving a request for themeasurements from system controller 128. Substrate measurement subsystem140 may be integrated within a portion of manufacturing system 100. Insome embodiments, substrate measurement subsystem 140 may be integratedwithin factory interface 106. In such embodiments, factory interfacerobot 126 may be configured to transfer substrates 102 between substratecarriers 122 and substrate measurement subsystem 140 and/or substratemeasurement subsystem 140 and load lock 120. In other or similarembodiments, substrate measurement subsystem 140 may not be integratedwith any portion of manufacturing system 100 and instead may be astand-alone component. In such embodiments, a substrate 102 measured atsubstrate measurement subsystem 140 may be transferred to and from aportion of manufacturing system 100 prior to or after the substrate 102is processed at manufacturing system 100.

Substrate measurement subsystem 140 may obtain measurements for aportion of substrate 102 by generating data associated with the portionof substrate 102. In some embodiments, substrate measurement subsystem140 is configured to generate spectral data, positional data, and othersubstrate property data for substrate 102. In some embodiments,substrate measurement subsystem 140 may include one or morereflectometry sensors (i.e., reflectometer). In such embodiments,spectral data generated by substrate measurement subsystem 140 may referto a reflected optical intensity of each wavelength of a wave reflectedfrom a portion of substrate 102. In other or similar embodiments,substrate measurement subsystem 140 may include one or more ellipsometrysensors (i.e., ellipsometer). In such embodiments, spectral datagenerated by substrate measurement subsystem 140 may refer to areflected optical intensity of a wavelength of a polarized light wavereflected from a portion of substrate 102. In other or similarembodiments, spectral data may refer to spectral data collected from,thermal spectra sensors, and so forth. As mentioned above, substratemeasurement subsystem 140 can generate other substrate property data forsubstrate 102 (i.e., non-spectral data). For example, substratemeasurement subsystem 140 can generate data based on signals collectedfrom eddy current (i.e., inductive) sensors, capacitive sensors, and soforth.

After generating data for substrate 102, substrate measurement subsystem140 may transmit the generated data to system controller 128. Responsiveto receiving data from substrate measurement subsystem 140, systemcontroller 128 may store the data at data store 150.

In some embodiments, data received by the system controller 128 fromsubstrate measurement subsystem 140 may be associated with data receivedfrom one or more sensors of processing chamber 114, 116, 118. Forexample, a first set of data for substrate 102 may be generated atsubstrate measurement system 140. In response system controller 128receiving the first set of data, substrate 102 may be transferred toprocessing chamber 114, 116, 118 for processing. At processing chamber114, 116, 118, a second set of data may be generated for substrate 102and transferred to system controller 128. Responsive to determining thefirst set of data is associated with the second set of data, systemcontroller 128 may generate a mapping between the first set of data andthe second set of data and store the generated mapping to data store150. Based on the mapping between the first set of data and the secondset of data, the system controller 128 may determine whether to modifythe process recipe for the substrate 102. Further details regardingsystem controller 128 determining whether to modify the process recipefor substrate 102 are provided with respect to FIG. 4.

In some embodiments, responsive to determining to modify the processrecipe, system controller 128 may provide a notification to an operatorof manufacturing system 100 indicating the process recipe should bemodified. In some examples, the notification may be provided via a GUIdisplayed via the client device, such as GUI 500 of FIG. 5. Thenotification may provide a recommendation to modify one or moreoperations of the process recipe along with a GUI element that enablesthe operator to accept or reject the modification to the process recipe.In other or similar embodiments, the notification may provide multiplealternative recommendations for modifications to one or more operationsof the process recipe along with one or more GUI elements that enablethe operator to select a recommendation over other alternativerecommendations. In some embodiments, system controller 128 may notprovide a notification to the operator of the manufacturing system 100and instead may modify the processing recipe based on an identificationof the best modification to the process recipe.

FIG. 2 is a cross-sectional schematic side view of a substratemeasurement subsystem 200, according to aspects of the presentdisclosure. Substrate measurement subsystem 200 may be configured toobtain measurements for one or more portions of a substrate, such assubstrate 102 of FIG. 1, prior to or after processing of substrate 102at a processing chamber. Substrate measurement subsystem 200 may obtainmeasurements for a portion of substrate 102 by generating dataassociated with the portion of substrate 102. In some embodiments,substrate measurement subsystem 200 may be configured to generatespectral data, positional data, and/or other property data associatedwith substrate 102. Substrate measurement subsystem 200 may include acontroller 230 configured to execute one or more instructions forgenerating data associated with a portion of substrate 102.

Substrate measurement subsystem 200 may include a substrate sensingcomponent 214 configured to detect when substrate 102 is transferred tosubstrate measurement subsystem 200. Substrate sensing component 214 mayinclude any component configured to detect when substrate 102 istransferred to substrate measurement subsystem 200. For example,substrate sensing component 214 may include an optical sensing componentthat transmits an optical beam across an entrance to substratemeasurement subsystem 200. Substrate sensing component 214 may detectthat a substrate 102 has been transferred to substrate measurementsubsystem 200 responsive to substrate 102 breaking the optical beamtransmitted across the entrance to substrate measurement subsystem 200as substrate 102 is placed within substrate measurement subsystem 200.Responsive to detecting that substrate 102 has been transferred tosubstrate measurement subsystem 200, substrate sensing component 214 maytransmit an indication to controller 230 indicating that substrate 102has been transferred to substrate measurement subsystem 200.

In some embodiments, substrate sensing component 214 may be furtherconfigured to detect identifying information associated with substrate102. In some embodiments, substrate 102 may be embedded within asubstrate carrier (not shown) when transferred to substrate measurementsubsystem 200. The substrate carrier may include one or moreregistration features that enable identification of substrate 102. Forexample, an optical sensing component of substrate sensing component 214may detect that substrate 102, embedded within the substrate carrier,has broken the optical beam transmitted across the entrance to substratemeasurement subsystem 200. The optical sensing component may furtherdetect one or more registration features included on the substratecarrier. Responsive to detecting the one or more registration features,the optical sensing component may generate an optical signatureassociated with the one or more registration features. Substrate sensingcomponent 214 may transmit the optical signature generated by theoptical sensing component to controller 230 along with the indicationthat the substrate has been placed within substrate measurementsubsystem 200. Responsive to receiving the optical signature fromsensing component 214, controller 230 may analyze the optical signatureto determine the identifying information associated with substrate 102.The identifying information associated with substrate 102 may include anidentifier for substrate 102, an identifier for a process for substrate102 (e.g., a batch number or a process run number), an identifier of atype for substrate 102 (e.g., a wafer, etc.), and so forth.

Substrate measurement subsystem 200 may include one or more componentsconfigured to determine a position and/or an orientation of substrate102 within substrate measurement subsystem 200. The position and/ororientation of substrate 102 may be determined based on anidentification of a reference location of substrate 102. A referencelocation may be a portion of substrate 102 that includes an identifyingfeature that is associated with a specific portion of substrate 102. Forexample, substrate 102 may have a reference tag embedded in a centerportion of substrate 102. In another example, substrate 102 may have oneor more structural features included on the surface of the substrate 102at a center portion of substrate 102. Controller 230 may determine anidentifying feature associated with a specific portion of substrate 102based on determined identifying information for substrate 102. Forexample, responsive to determining that substrate 102 is a wafer,controller 230 may determine one or more identifying features that aregenerally included at a portion of a wafer.

Controller 230 may identify the reference location for substrate 102using one or more camera components 250 configured to capture image datafor substrate 102. Camera components 250 may generate image data forwith one or more portions of the substrate 102 and transmit the imagedata to controller 230. Controller 230 may analyze the image data toidentify an identifying feature associated with a reference location forsubstrate 102. Controller 230 may further determine a position and/ororientation of substrate 102 as depicted in the image data based on theidentified identifying feature of substrate 102. Controller 230 maydetermine a position and/or orientation of substrate 102 based on theidentified identifying feature of substrate 102 and the determinedposition and/or orientation of substrate 102 as depicted in the imagedata.

Responsive to determining the position and/or orientation of substrate102, controller 230 may generate positional data associated with one ormore portions of substrate 102. In some embodiments, the positional datamay include one or more coordinates (e.g., Cartesian coordinates, polarcoordinates etc.) each associated with a portion of substrate 102, whereeach coordinate is determined based on a distance from the referencelocation for substrate 102. For example, responsive to determining theposition and/or orientation of substrate 102, controller 230 maygenerate first positional data associated with a portion of substrate102 that includes the reference location, where the first positionaldata includes a Cartesian coordinate of (0,0). Controller 230 maygenerate second positional data associated with a second portion ofsubstrate 102 that is relative to the reference location. For example, aportion of substrate 102 that is located approximately 2 nanometers (nm)due east of the reference location may be assigned a Cartesiancoordinate of (0, 1). In another example, a portion of substrate 102that is located 5 nms due north of the reference location may beassigned a Cartesian coordinate of (1, 0).

Controller 230 may determine one or more portions of substrate 102 tomeasure based on positional data determined for substrate 102. In someembodiments, controller 230 may receive one or more operations of aprocess recipe associated with substrate 102. In such embodiments,controller 230 may further determine the one or more portions ofsubstrate 102 to measure based on one or more operations of the processrecipe. For example, controller 230 may receive an indication that anetch process was performed for substrate 102 where several structuralfeatures were etched onto the surface of substrate 102. As a result,controller 230 may determine one or more structural features to measureand the expected locations of the features at various portions ofsubstrate 102.

Substrate measurement subsystem 200 may include one or more measurementcomponents for measuring substrate 102. In some embodiments, substratemeasurement subsystem 200 may include one or more spectra sensingcomponents 220 configured to generate spectral data for one or moreportions of substrate 102. As discussed previously, spectral data maycorrespond to an intensity (i.e., a strength or amount of energy) of adetected wave of energy for each wavelength of the detected wave.Further details regarding the collected spectral data is provided withrespect to FIG. 6. The measurement components for measuring substrate102 can also include non-spectral sensing components (not shown)configured to collect and generate non-spectral data. For example, themeasurement components can include an eddy current sensor or acapacitive sensor. Although some embodiments of the present descriptionmay refer to collecting and using spectral data for substrate 102,embodiments of the present description can be applicable to non-spectraldata collected for substrate 102.

A spectra sensing component 220 may be configured to detect waves ofenergy reflected from a portion of substrate 102 and generate spectraldata associated with the detected waves. Spectra sensing component 220may include a wave generator 222 and a reflected wave receiver 224. Insome embodiments, wave generator 222 may be a light wave generatorconfigured to generate a beam of light towards a portion of substrate102. In such embodiments, reflected wave receiver 224 may be configuredto receive a reflected light beam from the portion of substrate 102.Wave generator 222 may be configured to generate an energy stream 226(e.g., a light beam) and transmit energy stream 226 to a portion ofsubstrate 102. A reflected energy wave 228 may be reflected from theportion of substrate 102 and received by reflected wave receiver 224.Although FIG. 3A illustrates a single energy wave reflected off thesurface of substrate 102, multiple energy waves may be reflected off thesurface of substrate 102 and received by reflected wave receiver 224.

Responsive to reflected wave receiver 224 receiving reflected energywave 228 from the portion of substrate 102, spectra sensing component220 may measure a wavelength of each wave included in reflected energywave 228. Spectra sensing component 220 may further measure an intensityof each measured wavelength. Responsive to measuring each wavelength andeach wavelength intensity, spectra sensing component 220 may generatespectral data for the portion of substrate 102. Spectra sensingcomponent 220 may transmit the generated spectral data to controller230. Controller 230 may, responsive to receiving the generated spectraldata, generate a mapping between the received spectral data andpositional data for the measured portion of substrate 102.

Substrate measurement subsystem 200 may be configured to generate aspecific type of spectral data based on a type of measurement to beobtained at substrate measurement subsystem 200. In some embodiments,spectra sensing component 220 may be a first spectra sensing componentthat is configured to generate one type of spectral data. For example,spectra sensing component 220 may be configured to generatereflectometry spectral data, ellipsometry spectral data, hyperspectralimaging data, chemical imaging data, thermal spectral data, orconductive spectral data. In such embodiments, the first spectra sensingcomponent may be removed from substrate measurement subsystem 200 andreplaced with a second spectra sensing component configured to generatea different type of spectral data (e.g., reflectometry spectral data,ellipsometry spectral data, hyperspectral imaging data, or chemicalimaging data).

Controller 230 may determine a type of data (i.e., spectral data,non-spectral data) to be generated for substrate 102 based on a type ofmeasurement to be obtained for one or more portions of substrate 102. Insome embodiments, controller 230 may determine the one or more types ofmeasurements based on a notification received from system controller128. In other or similar embodiments, controller 230 may determine theone or more types of measurements based on an instruction to generate ameasurement for a portion of substrate 102. Responsive to determiningthe one or more types of measurements to be obtained, controller 230 maydetermine the type of data to be generated for substrate 102. ForExample, controller 230 can determine that spectral data is to begenerated for substrate 102 and that the second spectra sensingcomponent is an optimal sensing component for obtaining the determinedtype of measurements for the one or more portions of substrate 102.Responsive to determining the second sensing component is the optimalsensing component, controller 230 may transmit a notification to thesystem controller indicating that the first spectra sensing componentshould be replaced with the second spectra sensing component and thesecond spectra sensing component should be used to obtain the one ormore types of measurements for the one or more portions of substrate102. System controller 128 may transmit the notification to a clientdevice connected to the manufacturing system where the client device mayprovide the notification to a user of the manufacturing system (e.g., anoperator) via a GUI.

In other or similar embodiments, spectra sensing component 220 may beconfigured to generate multiple types of spectral data. In suchembodiments, controller 230 may cause spectra sensing component 220 togenerate a specific type of spectral data based on the type ofmeasurements to be obtained for one or more portions of substrate 102,in accordance with previously described embodiments. Responsive todetermining the type of measurements to be obtained, controller 230 maydetermine that a first type of spectral data is to be generated byspectra sensing component 220. Based on the determination that the firsttype of spectral data is to be generated by spectra sensing component220, controller 230 may cause spectra sensing component 220 to generatethe first type of spectral data for the one or more portions ofsubstrate 102.

As described previously, controller 230 may determine one or moreportions of substrate 102 to measure at substrate measurement subsystem200. In some embodiments, one or more measurement components, such asspectra sensing component 220, may be stationary components withinsubstrate measurement subsystem 200. In such embodiments, substratemeasurement subsystem 200 may include one or more positional components240 configured to modify a position and/or an orientation of substrate102 with respect to spectra sensing component 220. In some embodiments,positional components 240 may be configured to translate substrate 102along a first axis and or a second axis, relative to spectra sensingcomponent 220. In other or similar embodiments, positional components240 may be configured to rotate substrate 102 around a third axisrelative to spectra sensing component 220.

As spectra sensing component 220 generates spectral data for one or moreportions of substrate 102, positional components 240 may modify theposition and/or orientation of substrate 102 in accordance with the oneor more determined portions to be measured for substrate 102. Forexample, prior to spectra sensing component 220 generating spectral datafor substrate 102, positional components 240 may position substrate 102at Cartesian coordinate (0,0) and spectra sensing component 220 maygenerate first spectral data for substrate 102 at Cartesian coordinate(0,0). Responsive to spectra sensing component 220 generating firstspectral data for substrate 102 at Cartesian coordinate (0,0),positioning components 240 may translate substrate 102 along a firstaxis so that spectra sensing component 220 is configured to generatesecond spectral data for substrate 102 at Cartesian coordinate (0,1).Responsive to spectra sensing component 220 generating second spectraldata for substrate 102 at Cartesian coordinate (0,1), controller 230 mayrotate substrate 102 along a second axis so that spectra sensingcomponent 220 is configured to generate third spectral data forsubstrate 102 at Cartesian coordinate (1,1). This process may occurmultiple times until spectral data is generated for each determinedportion of substrate 102.

In some embodiments, one or more layers 212 of material may be includedon a surface of substrate 102. The one or more layers 212 may includeetch material, photoresist material, mask material, deposited material,etc. In some embodiments, the one or more layers 212 may include an etchmaterial to be etched according to an etch processed performed at aprocessing chamber. In such embodiments, spectral data may be collectedfor one or more portions of the un-etched etch material of the layer 212deposited on substrate 102, in accordance with previously disclosedembodiments. In other or similar embodiments, the one or more layers 212may include an etch material that has already been etched according anetch process at the processing chamber. In such embodiments, one or morestructural features (e.g., lines, columns, openings, etc.) may be etchedinto the one or more layers 212 of substrate 102. In such embodiments,spectral data may be collected for one or more structural featuresetched into the one or more layers 212 of substrate 102.

In some embodiments, substrate measurement subsystem 200 may include oneor more additional sensors configured to capture additional data forsubstrate 102. For example, substrate measurement subsystem 200 mayinclude additional sensors configured to determine a thickness ofsubstrate 102, a thickness of a film deposited on the surface ofsubstrate 102, etc. Each sensor may be configured to transmit captureddata to controller 230.

Responsive to receiving at least one of the spectral data, thepositional data, or the property data for the substrate 102, controller230 may transmit the received data to system controller 128 forprocessing and analysis, in accordance with embodiment described herein.

FIG. 3 depicts a cross-sectional schematic side view of a processingchamber 300, according to aspects of the present disclosure. Theprocessing chamber 300 may be used for processes in which a corrosiveplasma environment is provided. For example, the processing chamber 300may be a chamber for a plasma etcher or plasma etch reactor, a plasmacleaner, and so forth. In alternative embodiments other processingchambers may be used, which may or may not be exposed to a corrosiveplasma environment. Some examples of chamber components include achemical vapor deposition (CVD) chamber, a physical vapor deposition(PVD) chamber, an atomic layer deposition (ALD) chamber, an ion assisteddeposition (IAD) chamber, an etch chamber, and other types of processingchambers.

In one embodiment, the processing chamber 300 includes a chamber body302 and a showerhead 330 that encloses an interior volume 306. Thechamber body 302 generally includes sidewalls 308 and a bottom 310. Theshowerhead 330 may include a showerhead base and a showerhead gasdistribution plate 332. Alternatively, the showerhead 330 may bereplaced by a lid and a nozzle in some embodiments, or by multiple pieshaped showerhead compartments and plasma generation units in otherembodiments. An exhaust port 326 may be defined in the chamber body 302,and may couple the interior volume 306 to a pump system 328. The pumpsystem 328 may include one or more pumps and throttle valves utilized toevacuate and regulate the pressure of the interior volume 306 of theprocessing chamber 300.

The showerhead 330 may be supported on the sidewall 308 of the chamberbody 302. The showerhead 330 (or lid) may be opened to allow access tothe interior volume 306 of the processing chamber 300, and may provide aseal for the processing chamber 300 while closed. A gas panel (notshown) may be coupled to the processing chamber 300 to provide processand/or cleaning gases to the interior volume 306 through the showerhead330 or lid and nozzle (e.g., through apertures of the showerhead or lidand nozzle).

A substrate support assembly 348 is disposed in the interior volume 306of the processing chamber 300 below the showerhead 330. The substratesupport assembly 348 holds a substrate, such as substrate 102 of FIG. 1,during processing. In one embodiment, the substrate support assembly 348includes a pedestal 352 that supports an electrostatic chuck 350. Theelectrostatic chuck 350 further includes a thermally conductive base andan electrostatic puck bonded to the thermally conductive base. Thethermally conductive base and/or electrostatic puck of the electrostaticchuck 350 may include one or more optional embedded heating elements,embedded thermal isolators and/or conduits to control a lateraltemperature profile of the substrate support assembly 348. Theelectrostatic chuck 350 may include at least one clamping electrodecontrolled by a chucking power source.

Processing chamber 300 may include one or more sensors 360 configured togenerate data for a substrate 102 and/or an environment surroundingsubstrate 102 before, after, or during processing of substrate 102. Eachsensor 360 may be configured to transmit data to a controller, such assystem controller 128. In some embodiments, one or more sensors 360 maybe embedded within a component of processing chamber 300 and may beconfigured to capture data associated with a function of the component.For example, sensors 360A may be embedded within substrate supportassembly 348 and/or electrostatic chuck 350. During operation ofprocessing chamber 300, sensors 360A may generate data associated with atemperature of one or more heating elements embedded within theelectrostatic chuck 350, a lateral temperature profile of substratesupport assembly 348, an amount of power supplied by the chucking powersource, etc. In another example, sensors 360B may be embedded within thegas panel and/or showerhead 330. In such example, sensors 360B may beconfigured to generate data associated with a composition, flow rate andtemperature of process and/or cleaning gases provided to the interiorvolume 306 through showerhead 330. In other or similar embodiments, oneor more sensors 360 may be embedded within the interior volume 306 ofprocessing chamber 300 to capture data associated with the environmentsurrounding substrate 102 during a process. For example, sensors 360Cmay be embedded on a surface of the chamber body 302 (e.g., sidewall308). In such example, sensors 360C may be configured to generate dataassociated with a pressure of interior volume 306, a temperature ofinterior volume 306, an amount of radiation within interior volume 306,etc.

In some embodiments, one or more sensors 360 outside of processingchamber 300 may be configured to generate data for substrate 102 and/orthe environment surrounding substrate 102 before, after, or duringprocessing of substrate 344. For example, sensor 360D may be configuredto generate data associated with one or more portions of a surface ofsubstrate 102. A transparent window 370 may be embedded within at leastone of showerhead 330 or sidewalls 308. Sensor 360D may be an opticalemission device that includes a light source component and a lightreflection component. The light source component may be configured totransmit light through transparent window 370 to a portion of substrate102. Reflected light may be transmitted from the portion of substrate102, through transparent window 370, and received by light reflectioncomponent of sensor 360D. Sensor 360D may generate spectral dataassociated with the reflected light received by the light reflectioncomponent and may transmit the generated spectral data to a controller,such as system controller 128. In some embodiments sensor 360D may beconfigured to generate spectral data associated with a center portion ofsubstrate 102, as illustrated. In other or similar embodiments, sensor360D may be configured to generate spectral data associated with anotherportion of substrate 102 (e.g., an outer diameter of substrate 102).

FIG. 4 is a block diagram illustrating a system controller according toaspects of the present disclosure. In some embodiments, the systemcontroller may be system controller 128, described with respect toFIG. 1. System controller 128 may include a substrate data collectionagent 410 and a data store 420.

As illustrated, substrate data collection agent 410 may include asubstrate measurement subsystem data module 412 (referred to herein asSMS data module 412), a sensor data module 414, a data mapping module416, and a process recipe modification module 418. Substrate datacollection agent 410 may communicate with data store 420 that stores SMSdata 422, sensor data 424, data mappings 426, process recipe 428, andmodified process recipe 430.

Data store 420 may be configured to store data that is not accessible bya user of the manufacturing system. In some embodiments, all data storedat data store 420 may be inaccessible by a user (e.g., an operator) ofthe manufacturing system. In other or similar embodiments, a portion ofdata stored at data store 420 may be inaccessible by the user whileanother portion of data stored at data store 420 may be accessible bythe user. In some embodiments, one or more portions of data stored atdata store 420 may be encrypted using an encryption mechanism that isunknown to the user (e.g., data is encrypted using a private encryptionkey). In other or similar embodiments, data store 420 may includemultiple data stores where data that is inaccessible to the user isstored in one or more first data stores and data that is accessible tothe user is stored in one or more second data stores.

SMS data module 412 may be configured to receive data from a substratemeasurement subsystem, such as substrate measurement subsystem 200 ofFIG. 2. As described previously, system controller 128 may generate aninstruction to cause a substrate to be transferred to substratemeasurement subsystem 200 to obtain one or more measurements for thesubstrate before or after processing of the substrate at themanufacturing system. Responsive to system controller 128 receiving anindication that the substrate has been transferred to substratemeasurement subsystem 200, SMS data module 412 may transmit a request tosubstrate measurement subsystem 200 to obtain measurements for one ormore portions of the substrate.

As described previously, system controller 128 may control a process fora substrate at a manufacturing system in accordance with a processrecipe 428. In some embodiments, SMS data module 412 may determine theone or more portions of the substrate to be measured at substratemeasurement subsystem 200 based on the process recipe. For example, anoperation of the process recipe may include etching a layer of materialdeposited on a surface of the substrate at a processing chamber. Basedon the operation of the process recipe, SMS data module 412 maydetermine one or more portions of the surface of the substrate tomonitor before and after the etch process at the processing chamber. Insuch embodiments, SMS data module 412 may include an indication of thedetermined one or more portions of the substrate to be measured atsubstrate measurement subsystem 200 in the request to obtainmeasurements at substrate measurement subsystem 200. In suchembodiments, a controller at substrate measurement subsystem 200, suchas controller 230, may determine the one or more portions of thesubstrate to measure at substrate measurement subsystem 200, inaccordance with embodiments described herein.

Responsive to transmitting a request to obtain measurements, SMS datamodule 412 may receive SMS data 422 from substrate measurement subsystem200. SMS data 422 may include spectral data, positional data, propertydata, and so forth. In some embodiments, SMS data 422 may furtherinclude information associated with the substrate (e.g., an identifierfor the substrate) or a process associated with the substrate (e.g., abatch number or a process run number). Responsive to receiving SMS data422 from substrate measurement subsystem 200, SMS data module 412 maycause SMS data 422 to be stored at data store 420.

Sensor data module 414 may be configured to receive data from one ormore portions of a manufacturing system, such as processing chamber 300before, during, or after a process is performed for the substrate.Responsive to the substrate being transferred to processing chamber 300,sensor data module 414 may transmit a request to processing chamber 300to obtain measurements for one or more portions of the substrate before,during, or after a substrate process is performed at processing chamber300. In some embodiments, sensor data module 414 may receive datagenerated by one or more sensors at processing chamber 300 withouttransmitting a request to obtain measurements at processing chamber 300.In some embodiments, the measurements for the substrate obtained atprocessing chamber 300 may correspond to the measurements obtained atthe substrate measurement subsystem 200. In accordance with embodimentsdescribed with respect to SMS data module 412, sensor data module 414may determine one or more measurements to be obtained at processingchamber 300. For example, sensor data module 414 may determine one ormore portions of the substrate to be measured at processing chamber 300.

Sensor data module 414 may receive sensor data 424 from processingchamber 300 in response to transmitting the request for substrate datato processing chamber 300. Sensor data 424 may include spectral data,temperature data, pressure data, and so forth. In some embodiments,sensor data 424 may include information associated with the substrate ora process associated with the substrate (e.g., a substrate identifier ora process identifier), in accordance with previously describedembodiments. Responsive to receiving sensor data 424 from processingchamber 300, sensor data module 414 may cause sensor data 424 to bestored at data store 420.

Responsive to system controller 128 receiving SMS data 422 and sensordata 424, data mapping module 416 may generate a mapping between SMSdata 422 that is associated with sensor data 424. Data mapping module416 may determine whether received SMS data 422 for a given substrate isassociated with sensor data 424 for the given substrate, and vice versa.In some embodiments, data mapping module 416 may determine SMS data 422is associated with sensor data 424 based on a common sensor identifieror a common lot identifier. Responsive to determining SMS data 422 for agiven substrate is associated with sensor data 424 for the givensubstrate, data mapping module 416 may generate a mapping between SMSdata 422 and sensor data 424 and store the mapping, identified as datamapping 426, in data store 420.

It should be noted that, although embodiments of the present disclosuremay describe that the system controller 128 receives SMS data prior toreceiving sensor data 424, in some embodiments, system controller 128can receive sensor data 424 prior to receiving SMS data 422. Forexample, a first measurement for substrate 102 can be performed atprocessing chamber 300 and sensor data 424 can be transmitted to systemcontroller 128. Substrate can be transferred to substrate measurementsubsystem 200 (e.g., using a transfer robot) after processing atprocessing chamber 300. Substrate measurement subsystem 200 can performa second measurement for substrate 102 and transmit SMS data 422 tosystem controller 128, in accordance with embodiments described above.Further, it should be noted that multiple measurements can be performedat substrate measurement subsystem 200. For example, first SMS data 422can be obtained during a first measurement at substrate measurementsubsystem 200, sensor data 424 can be obtained during a secondmeasurement at processing chamber 300, and second SMS data 422 can beobtained during a third measurement at substrate measurement subsystem200.

In similar or alternative embodiments, substrate measurement subsystem200 can perform a first measurement and a second measurement forsubstrate 102. For example, substrate measurement subsystem 200 canobtain first SMS data 422 (e.g., spectral data) for substrate 102 andcan obtain second SMS data 422 (e.g., non-spectral data) for substrate102. At least one of the first SMS data 422 or second SMS data 422 canbe obtained before or after substrate 102 is processed at processingchamber 300.

Recipe modification module 418 may determine whether to modify processrecipe 428 based on a data mapping 426 generated by data mapping module416. Recipe modification module 418 may identify SMS data 422 (e.g.,first SMS data, second SMS data, etc.) and/or sensor data 424 mappedtogether by data mapping 426. In some embodiments, a type of SMS data422 corresponds to a type of sensor data 424. In such embodiments,recipe modification module 418 may compare SMS data 422 to sensor data424 to determine a difference between SMS data 422 and sensor data 424.Responsive to determining a difference between SMS data 422 and sensordata 424, recipe modification module 418 may compare the determineddifference to a difference threshold. Responsive to determining thedifference exceeds the difference threshold, recipe modification module418 may determine to modify the process recipe 428.

In some embodiments, recipe modification module 418 may determine aposition of the substrate within the processing chamber 300 based on amapping between SMS data 422 and sensor data 424. As describedpreviously, SMS data 422 can include spectral data generated for one ormore portions of the substrate at substrate measurement subsystem 200.SMS data 422 can further include positional data associated with thegenerated spectral data (e.g., Cartesian coordinates for each portion ofthe substrate). Also described previously, sensor data 424 can includespectral data generated at one or more portions of the substrate atprocessing chamber 300. Recipe modification module 418 may identifyfirst spectral data of SMS data 422 that corresponds to second spectraldata of sensor data 424. Recipe modification module 418 can determine aposition of the substrate within processing chamber 300 based onpositional data of SMS data 422 that is associated with the firstspectral data of SMS data 422. Recipe modification module can whether tomodify the process recipe for the substrate within processing chamber300 based on the determined position of the substrate within processingchamber 300.

In some embodiments, recipe modification module 418 may compare SMS data422 to target measurement value 432. Target measurement value 432 mayinclude target measurement values for one or more portions of thesubstrate. Responsive to determining a difference between SMS data 422and target measurement value 432 exceeds a difference threshold, recipemodification module 418 may determine to modify the process recipe 428.

In some embodiments, recipe modification module 418 may determine amodification to the process recipe 428 that is expected to account for adifference between SMS data 422 and sensor data 424 and/or SMS data 422and target measurement value 432. In some embodiments, recipemodification module 418 may determine a modification to the processrecipe 428 by providing the difference between the SMS data 422 andsensor data 424 and/or SMS data 422 and target measurement value 432 toa modification determination component (not shown). In such embodiments,the modification determination component may provide, to recipemodification module 418, a recommended modification to be made to theprocess recipe 428 based on the provided difference. In someembodiments, the modification determination component may be a ruledatabase that includes one or more rules associated with process recipemodifications that can be made in view of differences between differencebetween SMS data 422 and sensor data 424 and/or SMS data 422 and targetmeasurement value 432. In other or similar embodiments, modificationdetermination component can include a data structure that associates adifference between SMS data 422 and sensor data 424 and/or SMS data 422and target measurement value 432 to a process recipe modification.

In an illustrative example, modification determination component candetermine, based on a difference a difference between SMS data 422 andsensor data 424 and/or SMS data 422 and target measurement value 432,that a processing chamber used to process the substrate is associatedwith a non-uniform etch rate. Based on the determination that theprocessing chamber is associated with a non-uniform etch rate,modification determination component can identify one or more processparameter values to modify in order to achieve a uniform etch rate forfuture substrates processed at the processing chamber. An example of aprocess parameter value modification can include a decrease of atemperature at a first zone of a substrate support assembly and anincrease of a temperature of a first zone of the substrate supportassembly.

In some embodiments, recipe modification module 418 may transmit anotification to a client device connected to the manufacturing system,where the notification indicates a modification to the process recipe428 is recommended. The client device may display the notification to auser of the client device via a GUI, such as GUI 500 of FIG. 5. Recipemodification module 418 may receive, from the client device, aninstruction to modify the process recipe 428. Responsive to receivingthe instruction to modify the process recipe 428, recipe modificationmodule 418 may modify the process recipe and store the modified processrecipe 430 at data store 420. In some embodiments, recipe modificationmodule 418 may not transmit a notification to the client device andinstead may modify the process recipe.

As described above, a first measurement for substrate 102 can beperformed at processing chamber 300 and a second measurement forsubstrate 102 can be performed at substrate measurement subsystem 200.In such embodiments, substrate measurement subsystem 200 can determine aposition of the substrate 102 at the substrate measurement subsystem200, in accordance with previously described embodiments. Recipemodification module 418 can determine the position of the substratewithin the processing chamber 300 based on the mapping between SMS data422 (i.e., the second measurement) and the sensor data 424 (i.e., thefirst measurement). Recipe modification module 418 can compare the SMSdata 422 to the sensor data 424 and determine, based on the comparison,whether to modify the process recipe 428, in accordance with previouslydescribed embodiments.

In some embodiments, external metrology data can be collected forsubstrate 102 at an external metrology tool (e.g., before and/or afterthe substrate 102 is processed at processing chamber 300). Systemcontroller 128 can receive the external metrology data from the externalmetrology tool and can store the received external metrology data at thedata store, in accordance with previously described embodiments. Datamapping module 416 can update the data mapping for substrate 102 toinclude a mapping between the external metrology data and other data(e.g., SMS data 422, sensor data 424) for substrate 102. Recipemodification module 418 can determine whether to modify process recipe428 based on the updated data mapping 426 for substrate 102, inaccordance with previously described embodiments.

FIG. 5 illustrates an example graphical user interface (GUI) 500 forproviding notifications to a user (e.g., an operator) of a manufacturingsystem, according to aspects of the present disclosure. In someembodiments, GUI 500 may be presented to the user via a client deviceconnected to the manufacturing system.

GUI 500 may include one or more GUI elements to provide or receiveinformation from a user of the client device. GUI 500 may include asubstrate ID element 512 that provides an identifier of a substratebeing processed at the manufacturing system. For example, substrate IDelement 512 may provide an indication that substrate “S00-0001” is beingprocessed at the manufacturing system. GUI 500 may further include apending process recipe operation element 514 that provides an indicationof an operation of a process recipe that is to be performed for thesubstrate at a portion of the manufacturing system. As illustrated inFIG. 5, element 514 may provide an indication that an etch operation isto be performed for substrate. In some embodiments, element 514 maydetails regarding the operation to be performed for the substrate. Forexample, element 514 may provide an indication that the etch operationfor the substrate is to be performed at a processing chamber and theetch operation is to be performed for 3 minutes and 0 seconds.

GUI 500 may further include a recommended process recipe element 516that provides an indication of a recommended modification to one or moreoperations of the process recipe. As illustrated in FIG. 5, element 516may provide a recommended modification for an etch process for thesubstrate. The recommended modification may include etching thesubstrate for 4 minutes and 0 seconds instead of etching the substratefor 3 minutes and 0 seconds, as included in the original process recipe.In some embodiments, GUI 500 may also include a reason for modificationelement 518 which provides a reason that a modification to one or moreoperations of the process recipe is recommended. As illustrated in FIG.5, element 518 may indicate that the recommended modification to theprocess recipe is provided based on a determination that a filmdeposited on the substrate is thicker than expected.

GUI 500 may further include one or more interactive elements that enablea user of the client device to accept or reject a modification to therecipe. As illustrated in FIG. 5, a user may select an acceptmodification element 520A to accept the recommended modification to theprocess recipe indicated by element 516. Responsive to receiving anindication that a user has selected the accept modification element520A, the client device may generate and transmit a notification to thesystem controller including an instruction to modify the process recipein accordance with the recommended modification. A user may also selecta reject modification element 520B to reject the recommendedmodification to the process recipe. Responsive to receiving anindication that a user has selected the reject modification element520B, the client device may generate and transmit a notification to thesystem controller including an instruction to not modify the processrecipe in accordance with the recommended modification.

FIG. 6 illustrates example spectral data 600 generated from reflectedenergy received by the substrate measurement subsystem 200 of FIG. 2 orsensor 360D of FIG. 3, according to aspects of the present disclosure.As illustrated, multiple wave lengths may be included in reflectedenergy waves received by substrate measurement subsystem 200. Eachreflected energy wave may be associated with a different portion ofsubstrate 102. In some embodiments, an intensity may be measured foreach reflected energy wave received by substrate measurement subsystem200. As seen in FIG. 6, each intensity can be measured for eachwavelength of reflected energy waves received by substrate measurementsubsystem 200. The association between each intensity and eachwavelength can be the basis for the formation of spectral data 600. Insome embodiments, one or more wavelengths can be associated with anintensity value that is outside of an expected range of intensityvalues. For example, line 610 can be associated with an intensity valuethat is outside of the expected range of intensity values, asillustrated by lines 620. In such embodiments, the intensity value thatis outside of the expected range of intensity values can be anindication that a defect exists at a portion of substrate 102. Amodification may be made to a process recipe for substrate 102 based onthe indication of the defect at the portion of substrate 102, inaccordance with previously described embodiments.

FIGS. 7-10 are flow diagrams of various embodiments of methods 700-1000for determining whether to modify a process recipe for a substrate. Themethods 700-1000 are performed by processing logic that may includehardware (circuitry, dedicated logic, etc.), software (such as is run ona general purpose computer system or a dedicated machine), firmware, orsome combination thereof. Some methods 700-800 may be performed by acomputing device, such as system controller 128 of FIG. 1. Some methods900-1000 may be performed by a computing device, such as controller 230of FIG. 2.

For simplicity of explanation, the methods are depicted and described asa series of acts. However, acts in accordance with this disclosure mayoccur in various orders and/or concurrently, and with other acts notpresented and described herein. Furthermore, not all illustrated actsmay be performed to implement the methods in accordance with thedisclosed subject matter. In addition, those skilled in the art willunderstand and appreciate that the methods could alternatively berepresented as a series of interrelated states via a state diagram orevents.

FIG. 7 is a flow chart of a method 700 for determining whether to modifya process recipe for a substrate, according to aspects of the presentdisclosure. At block 710, processing logic identifies a substrate to beprocessed at a manufacturing system according to a process recipe. Atblock 720, processing logic generates an instruction to transfer thesubstrate to a substrate measurement subsystem to obtain a first set ofmeasurements for the substrate. In some embodiments, the first set ofmeasurements can include spectral or non-spectral data (e.g., eddycurrent data, capacitance data, etc.) for the substrate. At block 730,processing logic receives, from the substrate measurement subsystem, thefirst set of measurements for the substrate. At block 740, processinglogic generates an instruction to transfer the substrate from thesubstrate measurement subsystem to a processing chamber of themanufacturing system. At block 750, processing logic receives, from oneor more sensors within the processing chamber, a second set ofmeasurements for the substrate. In some embodiments, the second set ofmeasurements for the substrate can include spectral or non-spectral data(e.g., power data, temperature data, pressure data, etc.) for thesubstrate. At block 760, processing logic generates a mapping betweenthe first set of measurements and the second set of measurements of thesubstrate. At block 770, processing logic stores the first set ofmeasurements mapped to the second set of measurements. At block 780,processing logic determines, based on the first set of measurementsmapped to the second set of measurements, to modify the process recipefor the substrate. At block 790, processing logic optionally provides arecommendation to modify the recipe for the substrate via a graphicaluser interface.

As described above, in some embodiments, the processing logic cangenerate the instruction to transfer the substrate form the substratemeasurement system to the processing chamber of the manufacturing systemand receive the second set of measurements for the substrate prior togenerating the instruction to transfer the substrate to the substratemeasurement sub-system to obtain the first set of measurements for thesubstrate and receiving, from the substrate measurement subsystem, thefirst set of measurements for the substrate.

FIG. 8 is a flow chart of another method 800 for determining whether tomodify a process recipe for a substrate, according to aspects of thepresent disclosure. At block 810, processing logic receives, from one ormore sensors within a processing chamber of a manufacturing system, afirst set of measurements for a substrate. At block 820, processinglogic processes the substrate at the processing chamber in accordancewith a process recipe. At block 830, processing logic optionallyreceives, from the one or more sensors within the processing chamber, asecond set of measurements for the substrate. At block 840, processinglogic generates an instruction to transfer the substrate from theprocessing chamber to a substrate measurement subsystem to obtain athird set of measurements. At block 850, processing logic receives, formthe substrate measurement subsystem, a third set of measurements for thesubstrate. At block 860, processing logic generates a mapping betweenthe first set of measurements, the second set of measurements, and/orthe third set of measurements. At block 870, processing logic stores themapping between the first set of measurements, the second set ofmeasurements, and/or the third set of measurements. At block 880,processing logic determines, based on the mapping between the first setof measurements, the second set of measurements, and/or the third set ofmeasurements, to modify the recipe for the substrate. At block 890,processing logic optionally provides a recommendation to modify therecipe for the substrate via a graphical user interface.

FIG. 9 is a flow chart of a method 900 for obtaining data for asubstrate at a substrate measurement subsystem, according to aspects ofthe present disclosure. At block 910, processing logic receives anindication that a substrate being processed at a manufacturing systemhas been loaded into a substrate measurement subsystem. At block 920,processing logic determines positional data of the substrate within thesubstrate measurement subsystem. At block 930, processing logic receivesa recipe for the substrate. At block 940, processing logic determines,based on the positional data and the recipe of the substrate, one ormore portions of the substrate to be measured by one or more sensingcomponents of the substrate measurement subsystem. At block 950,processing logic obtains measurements for each of the determinedportions of the substrate by the one or more sensing components (e.g.,spectral sensing components, non-spectral sensing components, etc.) ofthe substrate measurement subsystem. At block 960, processing logictransmits the obtained measurements of each of the determined portionsof the substrate to a system controller.

FIG. 10 is a flow chart of a method 1000 for determining positional datafor a substrate within a substrate measurement subsystem, according toaspects of the present disclosure. At block 1010, processing logicdetermines an identification feature included on the substrate. In someembodiments, the identification feature can correspond to a referencelocation of the substrate (e.g., a center of the substrate). At block1020, processing logic identifies a portion of the substrate thatincludes the determined identification feature. At block 1030,processing logic generates an instruction to capture one or more imagesof the identified portion of the substrate. At block 1040, processinglogic determines, based on the captured one or more images, anorientation and/or a position of the substrate within the substratemeasurement subsystem. At block 1050, processing logic generatespositional data of the substrate based on the determined orientationand/or position of the substrate within the substrate measurementsubsystem.

FIG. 11 illustrates a diagrammatic representation of a machine in theexample form of a computing device 1100 within which a set ofinstructions, for causing the machine to perform any one or more of themethodologies discussed herein, may be executed. In alternativeembodiments, the machine may be connected (e.g., networked) to othermachines in a Local Area Network (LAN), an intranet, an extranet, or theInternet. The machine may operate in the capacity of a server or aclient machine in a client-server network environment, or as a peermachine in a peer-to-peer (or distributed) network environment. Themachine may be a personal computer (PC), a tablet computer, a set-topbox (STB), a Personal Digital Assistant (PDA), a cellular telephone, aweb appliance, a server, a network router, switch or bridge, or anymachine capable of executing a set of instructions (sequential orotherwise) that specify actions to be taken by that machine. Further,while only a single machine is illustrated, the term “machine” shallalso be taken to include any collection of machines (e.g., computers)that individually or jointly execute a set (or multiple sets) ofinstructions to perform any one or more of the methodologies discussedherein. In embodiments, computing device 1100 may correspond to systemcontroller 128 of FIG. 1 or controller 320 of FIG. 3.

The example computing device 1100 includes a processing device 1102, amain memory 1104 (e.g., read-only memory (ROM), flash memory, dynamicrandom access memory (DRAM) such as synchronous DRAM (SDRAM), etc.), astatic memory 1106 (e.g., flash memory, static random access memory(SRAM), etc.), and a secondary memory (e.g., a data storage device1128), which communicate with each other via a bus 1108.

Processing device 1102 may represent one or more general-purposeprocessors such as a microprocessor, central processing unit, or thelike. More particularly, the processing device 1102 may be a complexinstruction set computing (CISC) microprocessor, reduced instruction setcomputing (RISC) microprocessor, very long instruction word (VLIW)microprocessor, processor implementing other instruction sets, orprocessors implementing a combination of instruction sets. Processingdevice 1102 may also be one or more special-purpose processing devicessuch as an application specific integrated circuit (ASIC), a fieldprogrammable gate array (FPGA), a digital signal processor (DSP),network processor, or the like. Processing device 1102 may also be orinclude a system on a chip (SoC), programmable logic controller (PLC),or other type of processing device. Processing device 1102 is configuredto execute the processing logic for performing operations and stepsdiscussed herein.

The computing device 1100 may further include a network interface device1122 for communicating with a network 1164. The computing device 1100also may include a video display unit 1110 (e.g., a liquid crystaldisplay (LCD) or a cathode ray tube (CRT)), an alphanumeric input device1112 (e.g., a keyboard), a cursor control device 1114 (e.g., a mouse),and a signal generation device 1120 (e.g., a speaker).

The data storage device 1128 may include a machine-readable storagemedium (or more specifically a non-transitory computer-readable storagemedium) 1124 on which is stored one or more sets of instructions 1126embodying any one or more of the methodologies or functions describedherein. Wherein a non-transitory storage medium refers to a storagemedium other than a carrier wave. The instructions 1126 may also reside,completely or at least partially, within the main memory 1104 and/orwithin the processing device 1102 during execution thereof by thecomputer device 1100, the main memory 1104 and the processing device1102 also constituting computer-readable storage media.

While the computer-readable storage medium 1124 is shown in an exampleembodiment to be a single medium, the term “computer-readable storagemedium” should be taken to include a single medium or multiple media(e.g., a centralized or distributed database, and/or associated cachesand servers) that store the one or more sets of instructions. The term“computer-readable storage medium” shall also be taken to include anymedium that is capable of storing or encoding a set of instructions forexecution by the machine and that cause the machine to perform any oneor more of the methodologies of the present disclosure. The term“computer-readable storage medium” shall accordingly be taken toinclude, but not be limited to, solid-state memories, and optical andmagnetic media.

The preceding description sets forth numerous specific details such asexamples of specific systems, components, methods, and so forth in orderto provide a good understanding of several embodiments of the presentdisclosure. It will be apparent to one skilled in the art, however, thatat least some embodiments of the present disclosure may be practicedwithout these specific details. In other instances, well-knowncomponents or methods are not described in detail or are presented insimple block diagram format in order to avoid unnecessarily obscuringthe present disclosure. Thus, the specific details set forth are merelyexemplary. Particular implementations may vary from these exemplarydetails and still be contemplated to be within the scope of the presentdisclosure.

Reference throughout this specification to “one embodiment” or “anembodiment” means that a particular feature, structure, orcharacteristic described in connection with the embodiment is includedin at least one embodiment. Thus, the appearances of the phrase “in oneembodiment” or “in an embodiment” in various places throughout thisspecification are not necessarily all referring to the same embodiment.In addition, the term “or” is intended to mean an inclusive “or” ratherthan an exclusive “or.” When the term “about” or “approximately” is usedherein, this is intended to mean that the nominal value presented isprecise within ±10%.

Although the operations of the methods herein are shown and described ina particular order, the order of operations of each method may bealtered so that certain operations may be performed in an inverse orderso that certain operations may be performed, at least in part,concurrently with other operations. In another embodiment, instructionsor sub-operations of distinct operations may be in an intermittentand/or alternating manner.

It is understood that the above description is intended to beillustrative, and not restrictive. Many other embodiments will beapparent to those of skill in the art upon reading and understanding theabove description. The scope of the disclosure should, therefore, bedetermined with reference to the appended claims, along with the fullscope of equivalents to which such claims are entitled.

What is claimed is:
 1. A method comprising: receiving an indication thata substrate being processed at a manufacturing system has been loadedinto a substrate measurement subsystem; determining first positionaldata of the substrate within the substrate measurement subsystem;determining, based on the first positional data of the substrate and aprocess recipe for the substrate, one or more portions of the substrateto be measured by one or more sensing components of the substratemeasurement subsystem; obtaining measurements of each of the determinedportions of the substrate by one or more sensing components of thesubstrate measurement subsystem; and transmitting the obtainedmeasurements of each of the determined portions of the substrate to asystem controller.
 2. The method of claim 1, wherein the sensingcomponents of the substrate measurement subsystem comprise one or morespectra sensing components configured to generate spectral data for eachof the determined portions of the substrate.
 3. The method of claim 2,wherein the spectral data comprises at least one of: reflectometryspectral data, ellipsometry spectral data, hyperspectral imaging data,or chemical imaging data.
 4. The method of claim 2, wherein the one ormore spectra sensing components comprises a first type of spectrasensing component configured to generate a first type of spectral dataand a second type of spectra sensing component configured to generate asecond type of spectral data, and wherein the method further comprises:receiving an indication of one or more types of measurements to beobtained for each of the determined portions of the substrate by the oneor more sensing components of the substrate measurement subsystem; anddetermining, based on the indication of the one or more types ofmeasurements to be obtained for each of the determined portions of thesubstrate, the first type of spectral data, and the second type ofspectral data, whether to obtain measurements for each of the determinedportions of the substrate using the first type of spectra sensingcomponent or the second type of spectra sensing component.
 5. The methodof claim 2, wherein the one or more spectra sensing components comprisesa first type of spectra sensing component configured to generate a firsttype of spectral data, and wherein the method further comprises:receiving an indication of one or more types of measurements to beobtained for each of the determined portions of the substrate by the oneor more sensing components of the substrate measurement subsystem;determining, based on the on the indication of the one or more types ofmeasurements to be obtained for each of the determined portions of thesubstrate and the first type of spectral data, that a second type ofspectra sensing component configured to generate a second type ofspectral data is an optimal sensing component for obtaining the one ormore types of measurements for each of the determined portions of thesubstrate; and transmitting, based on the determination that the secondtype of spectra sensing component is the optimal sensing component forobtaining the one or more types of measurements, a notification to thesystem controller, the notification indicating that the first type ofspectra sensing component of the substrate measurement subsystem shouldbe replaced with the second type of spectra sensing component and thesecond type of spectra sensing component should be used to obtain theone or more types of measurements for each of the determined portions ofthe substrate.
 6. The method of claim 1, wherein determining positionaldata of the substrate within the substrate measurement subsystemcomprises: determining an identification feature included on thesubstrate that indicates a location of a portion of the substraterelative to a reference location of the substrate; generating aninstruction to generate one or more images of the substrate, wherein agenerated image includes a depiction of the identification featureincluded on the substrate; determining, based on the depiction of theidentification feature included in the generated image, at least one ofan orientation or a position of the substrate included in the substratemeasurement subsystem; and generating, based on the determinedorientation or the determined position of the substrate, the firstpositional data of the substrate, wherein the first positional datacomprises a first coordinate for the identification feature relative tothe reference location of the substrate.
 7. The method of claim 6,further comprising: determining second positional data corresponding toa determined portion of the substrate to be measured by the one or moresensing components, wherein the second positional data comprises asecond coordinate for the corresponding determined portion of thesubstrate relative to the first coordinate for the identificationfeature; responsive to obtaining measurements for the determinedportions of the substrate, generating a mapping between the obtainedmeasurement for the determined portion of the substrate and thecorresponding second positional data; and transmitting the mappingbetween the obtained measurement for the determined portion and thecorresponding second positional data to the system controller.
 8. Asubstrate measurement subsystem, comprising: one or more sensingcomponents configured to obtain measurements for one or more portions ofa substrate within the substrate measurement subsystem; and a controllercoupled to the one or more sensing components, wherein the controller isto: receive an indication that a substrate being processed at amanufacturing system has been loaded into the substrate measurementsubsystem; determine first positional data of the substrate within thesubstrate measurement subsystem; determine, based on the firstpositional data of the substrate and a process recipe for the substrate,one or more portions of the substrate to be measured by one or moresensing components of the substrate measurement subsystem; obtainmeasurements of each of the determined portions of the substrate by oneor more sensing components of the substrate measurement subsystem; andtransmit the obtained measurements of each of the determined portions ofthe substrate to a system controller.
 9. The substrate measurementsubsystem of claim 8, wherein the sensing components of the substratemeasurement subsystem comprise one or more spectra sensing componentsconfigured to generate spectral data for each of the determined portionsof the substrate.
 10. The substrate measurement subsystem of claim 9,wherein the spectral data comprises at least one of: reflectometryspectral data, ellipsometry spectral data, hyperspectral imaging data,or chemical imaging data.
 11. The substrate measurement subsystem ofclaim 9, wherein the one or more spectra sensing components comprises afirst type of spectra sensing component configured to generate a firsttype of spectral data and a second type of spectra sensing componentconfigured to generate a second type of spectral data, and wherein thecontroller is further to: receive an indication of one or more types ofmeasurements to be obtained for each of the determined portions of thesubstrate by the one or more sensing components of the substratemeasurement subsystem; and determine, based on the indication of the oneor more types of measurements to be obtained for each of the determinedportions of the substrate, the first type of spectral data, and thesecond type of spectral data, whether to obtain measurements for each ofthe determined portions of the substrate using the first type of spectrasensing component or the second type of spectra sensing component. 12.The substrate measurement subsystem of claim 9, wherein the one or morespectra sensing components comprises a first type of spectra sensingcomponent configured to generate a first type of spectral data, andwherein the controller is further to: receive an indication of one ormore types of measurements to be obtained for each of the determinedportions of the substrate by the one or more sensing components of thesubstrate measurement subsystem; determine, based on the on theindication of the one or more types of measurements to be obtained foreach of the determined portions of the substrate and the first type ofspectral data, that a second type of spectra sensing componentconfigured to generate a second type of spectral data is an optimalsensing component for obtaining the one or more types of measurementsfor each of the determined portions of the substrate; and transmit,based on the determination that the second type of spectra sensingcomponent is the optimal sensing component for obtaining the one or moretypes of measurements, a notification to the system controller, thenotification indicating that the first type of spectra sensing componentof the substrate measurement subsystem should be replaced with thesecond type of spectra sensing component and the second type of spectrasensing component should be used to obtain the one or more types ofmeasurements for each of the determined portions of the substrate. 13.The substrate measurement subsystem of claim 8, further comprising: oneor more position determination components configured to determine aposition of the substrate within the substrate measurement subsystem.14. The substrate measurement subsystem of claim 13, wherein todetermine positional data of the substrate within the substratemeasurement subsystem, the controller is to: determine an identificationfeature included on the substrate that indicates a location of a portionof the substrate relative to a reference location of the substrate;generate an instruction to cause the one or more position determinationcomponents to generate one or more images of the substrate, wherein agenerated image includes a depiction of the identification featureincluded on the substrate; determine, based on the depiction of theidentification feature included in the generated image, at least one ofan orientation or a position of the substrate included in the substratemeasurement subsystem; and generate, based on the determined orientationor position of the substrate, the first positional data of thesubstrate, wherein the first positional data comprises a firstcoordinate for the identification feature relative to the referencelocation of the substrate.
 15. A non-transitory computer readablestorage medium comprising instructions that, when executed by aprocessing device, cause the processing device to: receive an indicationthat a substrate being processed at a manufacturing system has beenloaded into a substrate measurement subsystem; determine firstpositional data of the substrate within the substrate measurementsubsystem; determine, based on the first positional data of thesubstrate and a process recipe for the substrate, one or more portionsof the substrate to be measured by one or more sensing components of thesubstrate measurement subsystem; obtain measurements of each of thedetermined portions of the substrate by one or more sensing componentsof the substrate measurement subsystem; and transmit the obtainedmeasurements of each of the determined portions of the substrate to asystem controller.
 16. The non-transitory computer readable storagemedium of claim 15, wherein the sensing components of the substratemeasurement subsystem comprise one or more spectra sensing componentsconfigured to generate spectral data for each of the determined portionsof the substrate.
 17. The non-transitory computer readable storagemedium of claim 16, wherein the spectral data comprises at least one of:reflectometry spectral data, ellipsometry spectral data, hyperspectralimaging data, or chemical imaging data.
 18. The non-transitory computerreadable storage medium of claim 16, wherein the one or more spectrasensing components comprises a first type of spectra sensing componentconfigured to generate a first type of spectral data and a second typeof spectra sensing component configured to generate a second type ofspectral data, and wherein the processing device is further to: receivean indication of one or more types of measurements to be obtained foreach of the determined portions of the substrate by the one or moresensing components of the substrate measurement subsystem; anddetermine, based on the indication of the one or more types ofmeasurements to be obtained for each of the determined portions of thesubstrate, the first type of spectral data, and the second type ofspectral data, whether to obtain measurements for each of the determinedportions of the substrate using the first type of spectra sensingcomponent or the second type of spectra sensing component.
 19. Thenon-transitory computer readable storage medium of claim 16, wherein theone or more spectra sensing components comprises a first type of spectrasensing component configured to generate a first type of spectral data,and wherein the processing device is further to: receive an indicationof one or more types of measurements to be obtained for each of thedetermined portions of the substrate by the one or more sensingcomponents of the substrate measurement subsystem; determine, based onthe on the indication of the one or more types of measurements to beobtained for each of the determined portions of the substrate and thefirst type of spectral data, that a second type of spectra sensingcomponent configured to generate a second type of spectral data is anoptimal sensing component for obtaining the one or more types ofmeasurements for each of the determined portions of the substrate; andtransmit, based on the determination that the second type of spectrasensing component is the optimal sensing component for obtaining the oneor more types of measurements, a notification to the system controller,the notification indicating that the first type of spectra sensingcomponent of the substrate measurement subsystem should be replaced withthe second type of spectra sensing component and the second type ofspectra sensing component should be used to obtain the one or more typesof measurements for each of the determined portions of the substrate.20. The non-transitory computer readable storage medium of claim 15,wherein to determine positional data of the substrate within thesubstrate measurement subsystem, the processing device is to: determinean identification feature included on the substrate that indicates alocation of a portion of the substrate relative to a reference locationof the substrate; generate an instruction to generate one or more imagesof the substrate, wherein a generated image includes a depiction of theidentification feature included on the substrate; determine, based onthe depiction of the identification feature included in the generatedimage, at least one of an orientation or a position of the substrateincluded in the substrate measurement subsystem; and generate, based onthe determined orientation or position of the substrate, the firstpositional data of the substrate, wherein the first positional datacomprises a first coordinate for the identification feature relative tothe reference location of the substrate.